Registration is now open for Flexographic Technical Association’s (FTA) Forum & INFOFLEX 2018, which will take place in Indianapolis, IN, May 6-9. Forum, with the event themed “Bringing It All Together: Processes, People and Potential,” is set to be hosted at the Indianapolis Marriott Downtown. Across the Skywalk, INFOFLEX will be “Where the Worlds of Package Printing and Converting Technologies Successfully Intertwine” at the Indiana Convention Center on May 7 and 8.

“The growth we are seeing in flexible packaging has been phenomenal,” says Forum chair Bob Coomes, Plastic Packaging Technologies, LLC. “This makes it even more important for those serving within the industry to identify trends in the consumer space; keep up with the latest in technology; and raise up a strong, productive workforce that will meet tomorrow’s challenges today. I believe that the session speakers at Forum 2018 will provide many ideas, insights and solutions that are relevant to those attending. It’s also a great opportunity to hear from industry experts and network with others within the ‘flexo-family.’ There will be something for everyone.”

Sessions will cover topics including the future of flexo, process improvements, equipment purchasing, understanding the customer’s customer, the importance of the press approval process, the role company culture and leadership play in a successful work environment, and more

Full Forum early bird rates, which end March 30, can save attendees up to $350. Registration includes Forum’s nine technical sessions, a seat at the Annual Awards Banquet, entry to walk the show floor at INFOFLEX and the Monday Evening Social. Attendees seeking entry only to the INFOFLEX exhibition will have access to the more than 240 exhibits at the Indiana Convention Center on both days, as well as the Monday Evening Social.

Joining Coomes as Forum 2018 co-chair is Ann Michaud of 3M.